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PRODUCT DATA of Eccobond Solder 56C
MaterialEccobond Solder 56C
Product DatasheetECCOBOND56C
Product TypeElectrically-conductive adhesive paste
Chemical CompositionEpoxy-Silver-loaded
Name of ManufacturerEmerson & Cumming
EXPERIENCE IN PRACTICE
Development StatusCommercial product
Cost Rangehigh
Lot ReproducibilityExcelent
Space ExperienceExtensive
ELECTRICAL PROPERTIES
Electrical Volume Resistivity2 x 10-6 ohm.m
THERMAL PROPERTIES
Thermal Conductivity5.8 W/m.K
Data Quality: Manufacturer's data
Thermal Expansion Coefficient36 μstrain/°C
Data Quality: Manufacturer's data
RELEVANT PROPERTIES FOR USE IN SPACE COMMUNITY
FlammabilityPass (23.8% O2)
Test: NASA NHB 8060-1B
Toxicity/OffgassingPass
Test:NASA NHB 8060-1A
Temperature Range(space)-60°C to +175°C.
Data Quality: Manufacturer's data
Outgassing(Avg data)TML = 0.30%, RML =0.20%, CVCM = 0.02%
Test: ECSS-Q-70-02
SPECIAL RECOMMENDATIONS
Special RecommendationsRecommended proportions are: 100 pbw resin + 2.5 pbw catalyst 9.
Recommended cure is 16 hours at 50°C.
Peel strength of this adhesive is low. Cycling to subzero temperatures can be detrimental.
Electrical bonds made with this adhesive to metals having a different EMF are likely to degrade in a humid environment, particularly if the metal layers are thin (e.g. vacuum deposits).
Different catalysts are available which will affect the properties, including temperature range and processing recommendations. Space experience with catalysts 9 and 11 is available.